Structure of CPHPC bound to Serum Amyloid P Component

(2R)-1-[6-[(2R)-2-carboxypyrrolidin-1-yl]-6-oxidanylidene-hexanoyl]pyrrolidine-2-carboxylic acid

Interaction of Serum Amyloid P Component with Hexanoyl Bis(D-Proline) (Cphpc)

60MM TRIS-HCL, 80MM NACL, 15% PEG550 MME, pH 7.6

SERUM AMYLOID P COMPONENT CO-CRYSTALLISED WITH MOBDG AT NEUTRAL PH

DECAMERIC DAMP COMPLEX OF HUMAN SERUM AMYLOID P COMPONENT

DECAMERIC STRUCTURE OF HUMAN SERUM AMYLOID P- COMPONENTBOUND TO BIS-1,2-{[(Z)-2-CARBOXY-2-METHYL- 1,3-DIOXANE]-5-YLOXYCARBAMOYL}-ETHANE

DECAMERIC CRYSTAL STRUCTURE OF HUMAN SERUM AMYLOID P- COMPONENT BOUND TO BIS-1,2-{[(Z)-2CARBOXY- 2-METHYL -1,3-DIOXANE]- 5-YLOXYCARBONYL}-PIPERAZINE

PENTAMERIC CRYSTAL STRUCTURE OF HUMAN SERUM AMYLOID P- COMPONENT BOUND TO BIS-1,2-{[(Z)-2CARBOXY-2-METHYL- 1,3-DIOXANE]-5-YLOXYCARBAMOYL}-ETHANE.

THE STRUCTURE OF SERUM AMYLOID P COMPONENT BOUND TO 0-PHOSPHO-THREONINE

STRUCTURE OF N-ACETYL-L-PROLINE BOUND TO SERUM AMYLOID P COMPONENT

SUGAR BINDING PROTEIN, LECTIN, METAL-BINDING

CHAIN A AND (RESSEQ 1:204 ) AND (NOT ELEMENT H)

CHAIN B AND (RESSEQ 1:204 ) AND (NOT ELEMENT H)

CHAIN C AND (RESSEQ 1:204 ) AND (NOT ELEMENT H)

CHAIN D AND (RESSEQ 1:204 ) AND (NOT ELEMENT H)

CHAIN E AND (RESSEQ 1:204 ) AND (NOT ELEMENT H)

CHAIN F AND (RESSEQ 1:204 ) AND (NOT ELEMENT H)

CHAIN G AND (RESSEQ 1:204 ) AND (NOT ELEMENT H)

CHAIN H AND (RESSEQ 1:204 ) AND (NOT ELEMENT H)

CHAIN I AND (RESSEQ 1:204 ) AND (NOT ELEMENT H)

CHAIN J AND (RESSEQ 1:204 ) AND (NOT ELEMENT H)